Nanoveu’s EMASS Advances 16nm ECS-DoT Chip and Launches Modular AIoT Kit

A Strategic Leap in AIoT Chip Development

Nanoveu Limited’s subsidiary, Embedded A.I. Systems (EMASS), has announced a significant technological advancement by commencing the 16nm synthesis phase of its flagship ECS-DoT AIoT system-on-chip. This milestone, achieved in partnership with the Centre of Nanoelectronics (CND) in Cairo, marks a pivotal transition from simulation prototypes to silicon production, leveraging Taiwan Semiconductor Manufacturing Company’s (TSMC) advanced 16nm FinFET process.

The move from a 22nm prototype to 16nm technology is not merely incremental; it delivers substantial benefits including a 50% reduction in chip area and a 25% decrease in power consumption. These improvements are critical for deploying AI solutions in energy-constrained edge environments, where compact size and ultra-low power usage are paramount.

Modular AIoT Development Kit Targets Real-World Applications

Alongside the chip development, EMASS has launched a Modular AIoT Development Kit designed to accelerate prototyping and integration across multiple sectors. The kit features a universal ECS-DoT baseboard with plug-and-play modules tailored for predictive maintenance, healthcare wearables, and asset tracking. Each module comes equipped with sensors, pre-trained AI models, and hardware abstraction layers to streamline development.

This modular approach not only simplifies the integration of AI at the edge but also signals Nanoveu’s intent to build a scalable ecosystem that empowers developers and innovators to rapidly deploy intelligent systems in diverse industrial and consumer applications.

Strategic Partnerships and Market Positioning

EMASS’s collaboration with CND is a cornerstone of this advancement, combining world-class nanoscale design expertise with access to emerging markets. The appointment of Dr. Yehia Massoud Ismail as Strategic Advisor further strengthens the company’s technical and strategic capabilities in VLSI design and AI hardware modelling.

With multi-project wafer fabrication slated for Q4 2025 and a full production tape-out anticipated in Q1 2026, Nanoveu is positioning itself as a platform leader in scalable AIoT and edge computing markets. The company’s Early Access Developer Program, offering SDKs and engineering support, aims to accelerate commercial adoption and foster a developer community around ECS-DoT.

Looking Ahead

Beyond chip fabrication, EMASS is advancing Phase 2 drone simulation testing, validating ECS-DoT’s AI control logic across various drone types and mission scenarios. This underscores the chip’s versatility as a control and sensing solution for intelligent unmanned systems, further broadening its commercial appeal.

Nanoveu’s CEO of the Semiconductor Division, Mark Goranson, highlighted the significance of this launch as a defining moment that combines performance, power efficiency, and compactness to meet the growing demand for edge AI solutions where every milliwatt counts.