Nanoveu’s $2M Placement Fuels High-Stakes Commercialisation Push

Nanoveu Limited has raised A$2 million through a strategic placement to accelerate the commercialisation of its 16nm ECS-DoT chip and expand its EMASS modular AIoT platform, positioning the company for global growth.

  • A$2 million placement at $0.055 per share to sophisticated investors
  • Funding to complete 16nm chip tape-out and support live drone trials
  • Phase 2 drone trials targeting 40-70% flight endurance improvements underway
  • Expansion of EMASS AIoT platform and commercial rollout of EyeFly3D and Nanoshield technologies
  • Progressing dual listing on U.S. OTCQB market to support international growth
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Strategic Capital Injection

Nanoveu Limited (ASX, NVU) has successfully raised A$2 million through a placement of over 36 million shares priced at 5.5 cents each. This capital raise attracted strong interest from both new and existing sophisticated investors, underscoring confidence in Nanoveu's recent technological milestones and growth trajectory.

The funds will be primarily deployed to finalise the tape-out of Nanoveu’s advanced 16nm ECS-DoT system-on-chip (SoC), a critical step towards commercialisation. This chip development, conducted in partnership with the Centre of Nanoelectronics and Devices, promises ultra-low-power AI processing capabilities tailored for smart devices and edge computing applications.

Advancing Drone Trials and AIoT Platform Rollout

Building on earlier successes that demonstrated a 33% increase in simulated drone flight time, Nanoveu is now conducting Phase 2 drone trials aiming for a 40-70% improvement in endurance across diverse flight conditions. Results from these trials are expected within the current quarter and could validate the practical benefits of Nanoveu’s semiconductor innovations in real-world applications.

Alongside chip development, the company is accelerating the rollout of its EMASS modular AIoT platform. This platform integrates Nanoveu’s cutting-edge SoCs with smart coatings and glasses-free 3D solutions, such as the EyeFly3D display technology and Nanoshield antimicrobial films. These complementary technologies position Nanoveu at the intersection of several high-growth markets, including AI, IoT, renewable energy, and digital 3D content.

Global Expansion and Market Positioning

Nanoveu’s strengthened balance sheet supports its ambitions for global expansion, including ongoing field trials of Nanoshield Solar in Morocco and the UAE. The company is also progressing an application for a dual listing on the U.S. OTCQB market, a move designed to broaden its investor base and enhance liquidity as it scales internationally.

Executive Chairman Dr David Pevcic highlighted the significance of this funding round, noting that with 22nm silicon already in hand and the 16nm architecture ready for fabrication, Nanoveu is at a pivotal juncture. The company is poised to transition from development to scalable commercial deployment, leveraging its diverse technology portfolio.

Overall, this capital raise not only fuels Nanoveu’s immediate development milestones but also signals growing market confidence in its innovative semiconductor and AIoT solutions.

Bottom Line?

Nanoveu’s latest funding round sets the stage for critical chip milestones and broader commercial breakthroughs in the coming months.

Questions in the middle?

  • Will Phase 2 drone trials meet the ambitious 40-70% endurance improvement targets?
  • How will the dual listing on the U.S. OTCQB market impact Nanoveu’s investor profile and share liquidity?
  • What are the timelines and market strategies for commercial rollout of the EMASS AIoT platform and EyeFly3D technology?