Nanoveu Accelerates 16nm Edge AI Chip Fabrication with Global Engineering Push

Nanoveu’s Strategic Leap in Semiconductor Innovation

Nanoveu Limited (ASX – NVU) has unveiled significant progress in the development of its next-generation 16nm ECS-DoT chip, a critical advancement in ultra-low power edge AI hardware. The company is targeting fabrication completion by the fourth quarter of 2025, leveraging Taiwan Semiconductor Manufacturing Company’s (TSMC) advanced 16nm FinFET process. This milestone marks a pivotal step in Nanoveu’s ambition to cement its position in the global semiconductor landscape, particularly within the burgeoning edge AI and IoT sectors.

Harnessing Top-Tier Talent Through Strategic Partnerships

Central to this progress is Nanoveu’s strategic collaboration with the Center for Nanoelectronics and Devices (CND), which provides access to a highly skilled regional engineering talent pool while maintaining cost efficiencies. The partnership has enabled the assembly of a 24-member engineering team spanning senior PhD-level experts, seasoned industry engineers, and emerging talent. This multidisciplinary team is driving full-stack innovation, covering analog, digital, and embedded system design, ensuring the ECS-DoT chip is optimized for power efficiency and AI performance.

Innovations in Chip Design and Packaging

The analog engineering division is focused on developing in-house wireless circuitry, analog-to-digital and digital-to-analog converters, and power management units essential for ultra-low-power communication. Meanwhile, the digital team is pushing boundaries with AI-optimized, memory-centric architectures and full system-on-chip (SoC) designs aimed at delivering intelligent decision-making capabilities at the edge with minimal latency and power consumption.

Complementing these design efforts, Nanoveu is transitioning the ECS-DoT platform to Ball Grid Array (BGA) packaging. This advanced packaging technique significantly reduces the chip’s footprint, enabling integration into compact devices such as drones, wearables, and IoT sensors, markets where space and power efficiency are paramount.

Expanding Software Capabilities to Support Market Readiness

Recognizing that hardware innovation must be paired with robust software, Nanoveu is expanding its embedded systems and edge AI software teams in Egypt and Singapore. These teams will focus on device firmware, system software integration, and application enablement, ensuring the ECS-DoT chip ships with a comprehensive software stack that enhances adoption readiness and customer compatibility.

Commercial Momentum with Current 22nm ECS-DoT Chip

While the 16nm chip is in development, Nanoveu is already commercializing its current 22nm ECS-DoT chip. The company is expanding its sales presence in the US and Europe and engaging early with original equipment manufacturers (OEMs) in wearables and drones. Early feedback and design wins suggest strong market interest, positioning Nanoveu well for volume production and broader adoption as the next-generation chip approaches fabrication.

Looking ahead, Nanoveu’s roadmap is ambitious, targeting applications across autonomous drones, smart wearables, edge healthcare, industrial IoT, robotics, and defense. The company’s integrated approach, combining cutting-edge silicon design, advanced packaging, and global software development, positions it to be a formidable player in the evolving edge AI ecosystem.